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- Data Inputs - Protel, DXP, Gerber, DXF, DWG, CAM
- Major Laminate - Kingboard, ShengYi and others produce bycustomer special request
- base Materials - FR4, other materials including High Tg, HighCTI, Halogen Free by special requested
- PCB Maximum board sizeHASL: 546mm x 320mm, OSP:630mm x 470mm, Ni/Au: 570mm x 470mm
- Rigid PCB thickness Single-
side to Double side from 0.2mm - 3.0mm
4 layers - 0.4mm - 3.0mm / 6 layers - 0.6mm - 3 .0mm / 8 layers -1.0mm - 3.0mm
10 layers - 1.20mm - 3.0mm /12 layers - 1.40mm - 3.0mm (Small runand Prototype only) - Surface Finishing - HAL / HASL, OSP, Immersion Gold, ImmersionTin
- Copper Foil - from 0.5oz to 6oz, inner layer up to3oz
- Min. Hole size - 0.20mm, Aspect ratio = 8
- Via holes - Copper PTH, Blind via
- HDI -Class 1 for single Blind via
- Impedance control tolerance- +/-10%
- Min. Line Width and Spacing- Max. 0.10mm / 0.10mm (4mil /4mil)
- Solder resist mask - Liquid Photo-Image (LPI)
- Silkscreen INK - Thermal
- Profiling - Routing, V-cut, Punching, CNC V-cut, Pushback
KDS Multilay PCB
